2023至2034年5G毫米波AiP的复合年增长率预计为40.7%。
2024-2034年5G和6G封装天线（AiP）：技术、趋势和市场
AiP、天线、半导体先进封装、衬底技术、5G、6G、相控阵、扇出、倒装芯片、玻璃、LTCC、HDI、EMI、波束成形
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IDTechEx最新发布的报告《2024-2034年5G和6G封装天线（AiP）：技术、趋势、市场》对5G和6G毫米波的AiP技术进行了详尽深入的研究。该报告重点关注各类基板和封装方法。此外还探讨了100 GHz以上的天线集成应用，并通过多项案例研究展示如何解决行业挑战。基于IDTechEx的专业知识，该报告为未来几代无线技术的天线封装发展前景提供了宝贵的见解。
Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms. This shift necessitates innovative technological advancements across devices, including RF and optical components, low-loss materials, and advanced semiconductor packaging technologies. Among these innovations, packaging stands out as a critical area requiring significant development and is the key focus of IDTechEx's report "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets".
IDTechEx's report, "Antenna in Package (AiP) for 5G and 6G 2024-2034," offers an in-depth exploration of AiP technologies designed to meet the requirements of 5G mmWave and upcoming 6G networks. It provides comprehensive analysis of diverse substrate materials including organic, LTCC, and glass, as well as packaging methods like flip-chip and fan-out. The report thoroughly examines these aspects from material properties, manufacturing feasibility, and supply chain viewpoints.
Additionally, it delves into antenna integration for applications beyond 100 GHz, offering insightful case studies and addressing prevalent challenges in the field. Leveraging IDTechEx's expertise, the report provides valuable insights into the dynamic landscape of antenna packaging technologies, forecasting the industry's future trajectory with advanced semiconductor packaging solutions at its core.
The overarching trend in antenna packaging technologies, especially at higher frequencies, is towards greater integration.
Antenna-in-package (AiP) represents an advanced antenna packaging technology utilized in high-frequency telecommunications. Leveraging the short wavelengths of mmWave applications, AiP enables the creation of significantly smaller antennas that can be seamlessly integrated directly into semiconductor packages, unlike traditional discrete antennas assembled as individual components on PCB. This integration of the antenna with the transceiver on a single chip offers a host of advantages, including enhanced antenna performance and greatly reduced package footprints. Advancing into the sub-THz range, potentially within the spectrum of 6G, research is underway on new antenna packaging technologies aimed at integrating antennas directly onto RF components. However, this area is still in the research phase due to various manufacturing and scalability challenges.
Overview of antenna packaging technologies vs operational frequency. Source: Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets from IDTechEx
Key design considerations for AiP
In the development of AiP technology for high-frequency communication devices, cost-effectiveness emerges as the utmost crucial consideration. With a target price of US$2 per 1x1 AiP module, affordability becomes pivotal for widespread adoption, although this presents a chicken-and-egg challenge where adoption must precede cost reduction through economies of scale. Utilizing cost-effective packaging materials and processes is essential. Additionally, miniaturization plays a critical role, especially for integration into consumer devices like smartphones, where component size is paramount. Ensuring that package size can be shrunk while maintaining performance and cost-effectiveness necessitates leveraging new packaging technologies.
Moreover, achieving high performance is vital for AiP platforms. This entails the fabrication and integration of high-gain, broadband mmWave antenna arrays, along with ensuring intra-system electromagnetic compatibility (EMC). Additionally, optimizing equivalent isotropic radiated power (EIRP) and ensuring signal integrity (SI) and power integrity (PI) are crucial aspects. Integrating high-quality factor (Q factor) passives to co-design active mmWave front-end transceiver components further enhances performance. Furthermore, reliability is essential, necessitating a direct thermal passage from the chip to the exterior to dissipate heat from power amplifiers. Scalability adds another layer of versatility, enabling the design of basic modules that can be upscaled to meet various applications with different power requirements. Addressing all these requirements is essential when designing an AiP module for high-frequency communication devices. Questions such as the choice of antenna element, substrate technology, substrate materials, limitations of each substrate technology, integration of passive devices, and supply chain maturity are all explored in IDTechEx's report.
Key aspects in the report:
Overview of 5G mmWave Development and 6G Roadmap:
a. Explore the status of 5G mmWave development, technology innovation roadmap, key applications, and market outlook.
b. Understand the landscape of 6G, including potential spectrum, enabling THz communication technologies, key research and industry activities, roadmap, technical targets, and applications.
Deep Dive into Beamforming Technologies Enabled by Phased Array Antenna for 5G mmWave:
a. Compare beamforming technologies of 5G sub-6 vs mmWave.
b. Examine phased array technologies, including antenna, semiconductor, and packaging integration components, technical requirements, trends, and design considerations.
Antenna Integration Technologies for 5G mmWave:
a. Discuss antenna substrate technology, benchmarking, material requirements, and packaging for phased arrays.
b. Explore various antenna packaging technologies for 5G mmWave, including antenna on PCB and antenna in package (AiP), categorized by packaging technologies: Flip-chip vs fan-out. Also, discuss substrate material choices, such as LTCC, low-loss organic-based, and glass, covering production challenges, material choices and benchmark, solutions/case studies from key players, and substrate design considerations for each packaging technology.
Antenna Integration Technologies for Applications Beyond 100 GHz:
a. Address challenges in 6G transceiver development, focusing on power requirements, antenna gain, and phased array demands.
b. Discuss various potential packaging technologies for beyond 100 GHz applications, covering thermal management options and low-loss material choices for antenna substrates. Include case studies showcasing D-band (110-170 GHz) phased array technology.
10-year granular market forecast of:
- 5G infrastructure:-5G mmWave base station forecast 2023-2034
- Antenna Elements Forecast (Infrastructure)
- AiP for 5G mmWave infrastructure shipment forecast 2023-2034
- AiP for mmWave 5G infrastructure shipment forecast by packaging technology 2024-2034
- mmWave antenna substrate forecast for 5G infrastructure (m2) 2023-2034
- mmWave antenna substrate forecast by material type for 5G infrastructure 2023-2034
5G consumer devices: Smartphone and CPE-AiP module shipment in mmWave compatible smartphone forecast 2023-2034
- AiP module shipment in mmWave-compatible smartphones by packaging technology 2023-2034
- mmWave smartphone antenna area substrate by packaging technology 2023-2034
- 5G mmWave CPE shipment forecast 2023-2034
- 5G CPE mmWave AiP module shipment forecast by packaging technology 2023-2034
- 5G CPE mmWave AiP substrate area forecast by packaging technology 2023-2034
| Report Metrics | Details |
|---|---|
| Historic Data | To 2023 |
| CAGR | The CAGR for AiP in 5G mmWave is projected to be 40.7% from 2023 to 2034. |
| Forecast Period | 2024 - 2034 |
| Forecast Units | unit (millions); area (thousand m2); |
| Regions Covered | Worldwide |
| Segments Covered | Base station, CPE, smartphone Antenna Elements, AiP module (by flipchip vs fanout) Antenna substrate |
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| 1. | EXECUTIVE SUMMARY |
| 1.1. | 5G&6G development and standardization roadmap |
| 1.2. | Mobile Telecommunication Spectrum and Network Deployment Strategy |
| 1.3. | 5G Commercial/Pre-commercial Services by Frequency |
| 1.4. | mmWave now and future |
| 1.5. | Global trends and new opportunities in 5G/6G |
| 1.6. | Overview of challenges, trends and innovations for high frequency communication (mmWave & THz) devices |
| 1.7. | Navigating Challenges and Solutions in mmWave phased array system |
| 1.8. | Integration requirement for phased array |
| 1.9. | Antenna packaging requirement |
| 1.10. | Benchmarking three antenna packaging technologies |
| 1.11. | The goal of next generation phased array |
| 1.12. | Overview of antenna packaging technologies vs operational frequency |
| 1.13. | Antenna-in-Package (AiP) vs Conventional Discrete Antenna Techniques in Wireless Systems |
| 1.14. | Key Design Considerations for AiP |
| 1.15. | Overview of low-loss materials for phased array substrate |
| 1.16. | Dk and Df comparison of material for phased array substrate |
| 1.17. | Other Material Requirement for Phased Array Substrate |
| 1.18. | Benchmark of substrate material properties for AiP |
| 1.19. | Benchmark of substrate technology for AiP |
| 1.20. | Trend: Choices of low-loss materials for AiP |
| 1.21. | Summary of substrate technology for AiP |
| 1.22. | Flip-chip vs Fan-out AiP: Benchmark |
| 1.23. | Choices of antenna packaging technologies for 6G |
| 1.24. | Antenna on chip (AoC) for 6G |
| 1.25. | Methods to improve antenna performance in AoC |
| 1.26. | Key trends for EMI shielding implementation |
| 1.27. | AiP for 5G mmWave infrastructure shipment forecast 2023-2034 |
| 1.28. | AiP for mmWave 5G infrastructure shipment forecast by packaging technology 2024-2034 |
| 1.29. | 5G CPE mmWave AiP module shipment forecast by packaging technology |
| 1.30. | AiP module shipment in mmWave-compatible smartphones by packaging technology 2023-2034 |
| 1.31. | Summary: Choices of packaging technology for AiP |
| 1.32. | Roadmap for antenna packaging development for 6G |
| 1.33. | mmWave AiP ecosystem |
| 2. | INTRODUCTION TO PACKAGING TECHNOLOGIES |
| 2.1. | General electronic packaging - an overview |
| 2.2. | Advanced semiconductor packaging - an overview |
| 2.3. | Overview of semiconductor packaging technologies |
| 2.4. | System in Package (SIP) |
| 2.5. | System in Package (SiP) |
| 2.6. | System-in-package enabling technologies for mobile |
| 3. | 5G AND 6G: OVERVIEW |
| 3.1. | 5G&6G development and standardization roadmap |
| 3.2. | Spectrum Characteristics From 2G to 6G |
| 3.3. | 6G performance with respect to 5G |
| 3.4. | 5G |
| 3.5. | Two types of 5G: Sub-6 GHz and mmWave |
| 3.6. | Mobile Telecommunication Spectrum and Network Deployment Strategy |
| 3.7. | 5G Commercial/Pre-commercial Services by Frequency (by end of 2023) |
| 3.8. | Drivers for Ultra Dense Network (UDN) Deployment in 5G |
| 3.9. | 5G base station types: Macro cells and small cells |
| 3.10. | Range/data rates for 5G base station |
| 3.11. | Three types of 5G services |
| 3.12. | 5G brings in new use cases beyond mobile applications |
| 3.13. | 5G for home: Fixed wireless access (FWA) |
| 3.14. | 5G Customer Premise Equipment (CPE) |
| 3.15. | The main technique innovations in 5G |
| 3.16. | Overview of challenges, trends and innovations for high frequency communication (mmWave & THz) devices |
| 3.17. | 5G supply chain overview |
| 3.18. | 6G |
| 3.19. | Beyond 5G Wireless - the pros and the cons |
| 3.20. | Summary of Key 6G Activities and Future Roadmap |
| 3.21. | Overview of key technologies that enable THz communication |
| 3.22. | Short and long term technical targets for 6G radio |
| 3.23. | 6G - an overview of key applications |
| 4. | BEAMFORMING FOR MMWAVE COMMUNICATION |
| 4.1. | Beamforming required for mmWave communication |
| 4.2. | How to create beamforming in mmWave? |
| 4.3. | Beamforming Technology Options: Analog, Digital, or Hybrid? - 1 |
| 4.4. | Beamforming Technology Options: Analog, Digital, or Hybrid? - 2 |
| 4.5. | Achieve mmWave beamforming with phased array design |
| 4.6. | 5G Sub-6 vs mmWave: Different beamforming approaches |
| 5. | PHASED ARRAY TECHNOLOGY |
| 5.1. | Navigating Challenges and Solutions in mmWave phased array system |
| 5.2. | Antenna technology |
| 5.3. | Antenna size shrinks with higher frequency |
| 5.4. | System channel capacity |
| 5.5. | Key metrics that predict the antenna performance |
| 5.6. | Overview of antenna design considerations |
| 5.7. | Choices of antenna type |
| 5.8. | Antenna type benchmark |
| 5.9. | Key aspects of phased array antenna packaging consideration |
| 5.10. | RF front-end technology |
| 5.11. | RF front-end for mmWave phased array - 1 |
| 5.12. | RF front-end for mmWave phased array - 2 |
| 5.13. | mmWave RF beamformer (beamforming integrated circuit (BFIC)) |
| 5.14. | mmWave BFIC suppliers for 5G infrastructures |
| 5.15. | Choices of semiconductors for mmWave phased array |
| 5.16. | Five forces analysis of the 5G mmWave RF module market |
| 5.17. | Integration |
| 5.18. | Phased array antenna front-end density |
| 5.19. | Phased array antenna architecture |
| 5.20. | Integration requirement for phased array |
| 5.21. | A modular approach to phased array scaling |
| 5.22. | Modular phased array on flexile LCP substrate |
| 5.23. | Example: A Scalable Heterogeneous phase array AiP Module - IBM |
| 5.24. | Considerations related to scaling phased arrays |
| 5.25. | Summary of phase array technology for mmWave |
| 6. | PHASED ARRAY ANTENNA PACKAGING TECHNOLOGIES |
| 6.1. | Introduction |
| 6.1.1. | Challenges and trends for mmWave phased array |
| 6.1.2. | Antenna packaging requirement |
| 6.1.3. | Antenna Integration Challenges in mmWave phased array |
| 6.1.4. | Benchmarking three antenna packaging technologies |
| 6.2. | Antenna Substrate Technology |
| 6.2.1. | The goal of next generation phased array |
| 6.2.2. | Key Substrate Features Impacting Phased Array Antenna Performance |
| 6.2.3. | Impact of the number of metal layers and L/S features on insertion loss |
| 6.2.4. | Via dimension |
| 6.2.5. | Bumping technology |
| 6.2.6. | Evolution of bumping technologies |
| 6.2.7. | Overview of low-loss materials for phased array substrate |
| 6.2.8. | Dk and Df comparison of material for phased array substrate |
| 6.2.9. | Other Material Requirement for Phased Array Substrate |
| 6.2.10. | Effect of dielectric material on antenna package thickness - 1 |
| 6.2.11. | Effect of dielectric material on antenna package thickness - 2 |
| 6.2.12. | Effect of dielectric material on antenna array scanning angle |
| 6.2.13. | Benchmark of materials for antenna packaging substrate |
| 6.2.14. | Benchmark of substrate technology for antenna packaging |
| 6.3. | Antenna on PCB |
| 6.3.1. | Antenna on PCB |
| 6.3.2. | Case studies: 28GHz antenna array with 256 antenna elements on PCB |
| 6.3.3. | Case studies: Samsung's 39-GHz Phased Array with antennas on PCB |
| 6.3.4. | Case studies: CPEs and access points teardown |
| 6.3.5. | Case studies: Taoglas mmWave antenna |
| 6.3.6. | Case studies: Satellite and Phased-array Radar |
| 6.3.7. | Case studies: Satellite and Phased-array Radar |
| 6.3.8. | Summary: Antenna on PCB |
| 6.4. | Antenna in Package |
| 6.4.1. | Antenna in Package (AiP) |
| 6.4.2. | AiP vs Conventional Discrete Antenna Techniques in Wireless Systems |
| 6.4.3. | Antenna in Package: Complex Integration Across Multidisciplinary Domains |
| 6.4.4. | Key Design Considerations for AiP |
| 6.4.5. | Integration of passive components in AiP - 1 |
| 6.4.6. | Integration of passive components in AiP - 2 |
| 6.4.7. | Two types of AiP structures: Flip-chip vs Embedded IC (Fan-Out) |
| 6.4.8. | Flip-chip vs Fan-out: Benchmark - 1 |
| 6.4.9. | Flip-chip vs Fan-out: Benchmark - 2 |
| 6.4.10. | What dominates transmission loss in a package? |
| 6.4.11. | Impact of surface roughness on transmission loss in a package: Flip chip vs Fan-out |
| 6.4.12. | Impact of bumping technology on transmission loss in a package: Flip chip vs Fan-out |
| 6.5. | Introduction to Flip-Chip packaging for AiP |
| 6.5.1. | Choice of substrate technologies for Flip-chip based AiP |
| 6.5.2. | Flip-chip based substrate requirement |
| 6.6. | LTCC Flip-chip based AiP |
| 6.6.1. | Multilayer low temperature co-fired ceramic (LTCC) |
| 6.6.2. | Multilayer LTCC: Production challenge |
| 6.6.3. | LTCC technology for AiP |
| 6.6.4. | AiP based on LTCC substrate example |
| 6.6.5. | LTCC substrate from Micro Systems Technologies |
| 6.6.6. | LTCC substrate design consideration |
| 6.6.7. | Benchmark of LTCC materials and players |
| 6.6.8. | Case studies: TDK's LTCC AiP |
| 6.6.9. | Case studies: Kyocera's LTCC AiP |
| 6.6.10. | Case studies: TMYTEK's LTCC (NTK/NGK) AiP |
| 6.6.11. | Case studies: TMYTEK's LTCC (Dupont) AiP |
| 6.6.12. | LTCC for AiP: Current Issues |
| 6.6.13. | Multi-type LTCC tape system |
| 6.7. | HDI (High density interconnect) AiP |
| 6.7.1. | High density interconnect (HDI) technology |
| 6.7.2. | Benchmarking of commercial low-loss materials for HDI AiP |
| 6.7.3. | Ajinomoto Group's Ajinomoto Build Up Film (ABF) |
| 6.7.4. | Murata's multi-layer LCP substrate for mmWave AiP modules |
| 6.7.5. | AT&S BT substrate for AiP |
| 6.7.6. | Low-loss HDI substrate roadmap from Unimicron |
| 6.7.7. | Example: HDI stack-up based on FR4 |
| 6.7.8. | Example: HDI stack-up based on LCP |
| 6.7.9. | Example: HDI stack-up based on hybrid substrate |
| 6.7.10. | Hybrid system: Cost reduction for high frequency circuit boards |
| 6.7.11. | Example: mmWave 32-Element Phased-Array Antenna based on a hybrid board |
| 6.7.12. | Case studies: Fraunhofer & Ericsson's Scalable AiP |
| 6.7.13. | Stack-up AiP module on a system board |
| 6.7.14. | PCB embedding process for AiP |
| 6.7.15. | ASE's AiP solutions - 1 |
| 6.7.16. | ASE's AiP solutions - 2 |
| 6.7.17. | JCET's AiP solutions |
| 6.7.18. | Amkor's antenna packaging solutions |
| 6.7.19. | Amkor's AiP solutions for 5G mmWave |
| 6.7.20. | Antenna on Package |
| 6.7.21. | Qualcomm: Antenna in package design (antenna on a substrate with flip chipped ICs) |
| 6.7.22. | Qualcomm 5G NR Modem-to-Antenna module |
| 6.7.23. | IBM AiP structure |
| 6.7.24. | Surface Laminated Circuit (SLC) technology for AiP |
| 6.7.25. | 90 GHz phase array antenna - demonstration from Nokia |
| 6.8. | Fan-out packaging for AiP |
| 6.8.1. | Fan-out packaging - introduction |
| 6.8.2. | Redistribution Layer (RDL) |
| 6.8.3. | Two types of fan-out: Panel level |
| 6.8.4. | Two types of fan-out: Wafer level |
| 6.8.5. | Wafer level package - introduction |
| 6.8.6. | Wafer level fan-out packaging: Process flow |
| 6.8.7. | Through Via and Vertical Interconnection in FOWLP |
| 6.8.8. | Wafer level vs Panel level: The differences |
| 6.8.9. | FO Technology roadmap |
| 6.8.10. | FOWLP in other applications areas (automotive radar) |
| 6.8.11. | Three types of AiP using fan-out technology |
| 6.8.12. | FOWLP for antenna in package |
| 6.8.13. | Case studies: TSMC InFO for mobile AiP |
| 6.8.14. | Passive devices integration in AiP |
| 6.8.15. | Case studies: Scalable Fan-out AiP from NEC - 1 |
| 6.8.16. | Case studies: Scalable Fan-out AiP from NEC - 2 |
| 6.8.17. | Case studies: Double sided mold Fan-out AiP from nepes |
| 6.8.18. | Case studies: ASE's fan-out AiP solution |
| 6.8.19. | Two types of IC-embedded technology - Players |
| 6.8.20. | Two types of IC-embedded technology - Players |
| 6.9. | Glass-based AiP |
| 6.9.1. | Glass substrate |
| 6.9.2. | Benchmark of various glass substrates |
| 6.9.3. | key extrinsic properties of glass |
| 6.9.4. | Case studies: Glass-based Flip-chip AiP from Georgia Tech |
| 6.9.5. | Case studies: Flip-chip Glass-based AiP from Dai Nippon |
| 6.9.6. | Glass-based AiP based on embedded IC |
| 6.9.7. | Glass vs molding compound |
| 6.9.8. | Challenges of glass packaging |
| 7. | OPPORTUNITIES IN PACKAGING AND INTEGRATION FOR APPLICATIONS BEYOND 100 GHZ |
| 7.1. | Antenna types in 6G |
| 7.2. | Antenna approaches |
| 7.3. | Challenges in 6G antennas |
| 7.4. | Antenna gain vs number of arrays |
| 7.5. | Trade-off between power and antenna array size |
| 7.6. | Challenges in Integrating 6G Antenna Arrays with Current PCB Processes |
| 7.7. | Three Alternatives to Antenna-on-PCB for 6G |
| 7.8. | Antenna on chip (AoC) for 6G |
| 7.9. | Methods to improve antenna performance in AoC |
| 7.10. | Example: D-band AoC phased array from NEC |
| 7.11. | Bumping technologies for future 6G AiP |
| 7.12. | Thermal management challenges for 6G devices |
| 7.13. | Cooling options for 6G Antenna-in-Package |
| 7.14. | Cooling options for other 6G antenna packages |
| 7.15. | Minimize insertion loss for 6G devices |
| 7.16. | Roadmap for development of low-loss materials for 6G |
| 7.17. | Organic interposer package for 6G |
| 7.18. | LTCC for 6G: Requirement |
| 7.19. | LTCC for 6G: Fraunhofer IKTS |
| 7.20. | Glass interposers for 6G |
| 7.21. | Ceramics for 6G: Overview |
| 7.22. | PPE for 6G: Taiyo Ink, Georgia Institute of Technology |
| 7.23. | IDTechEx outlook of low-loss materials for 6G |
| 7.24. | State-of-the-art D-band transmitters benchmark |
| 7.25. | Case studies: 140 GHz THz prototype from Samsung - device architecture |
| 7.26. | Case studies: UCSB 135 GHz MIMO hub transmitter array tile module |
| 7.27. | Case studies: Mounting InP PA to the LTCC Carrier |
| 7.28. | Case studies: Fully Integrated 2D Scalable TX/RX Chipset for D-Band (110 to 170GHz) Phased-Array-on-Glass Modules from Nokia |
| 7.29. | Antenna packaging trend for 6G |
| 7.30. | Summary |
| 8. | EMI SHIELDING |
| 8.1. | How does EMI shielding work? |
| 8.2. | System-in-package architecture with integrated EMI shielding for 5G |
| 8.3. | Impact of changes in semiconductor package design |
| 8.4. | Impact of trends in integrated circuit demand on EMI shielding industry |
| 8.5. | Key trends for EMI shielding implementation |
| 8.6. | Package shielding involves compartmental and conformal shielding |
| 9. | MARKET FORECAST |
| 9.1. | 5G mmWave infrastructure |
| 9.2. | 5G mmWave base station forecast 2023-2034 |
| 9.3. | 5G mmWave base station forecast 2023-2034 |
| 9.4. | Antenna Elements Forecast (Infrastructure) |
| 9.5. | Antenna Elements Forecast (Infrastructure) |
| 9.6. | AiP for 5G mmWave infrastructure shipment forecast 2023-2034 |
| 9.7. | AiP for mmWave 5G infrastructure shipment forecast by packaging technology 2024-2034 |
| 9.8. | mmWave antenna substrate forecast (m2) 2023-2034 |
| 9.9. | mmWave antenna substrate forecast by material type 2023-2034 |
| 9.10. | Smartphone and CPE |
| 9.11. | AiP module shipment in mmWave compatible smartphone forecast 2023-2034 |
| 9.12. | AiP module shipment in mmWave-compatible smartphones by packaging technology 2023-2034 |
| 9.13. | mmWave smartphone antenna area substrate by packaging technology 2023-2034 |
| 9.14. | 5G mmWave CPE shipment forecast 2023-2034 |
| 9.15. | 5G CPE mmWave AiP module shipment forecast by packaging technology |
| 9.16. | 5G CPE mmWave AiP substrate area forecast by packaging technology |
| 9.17. | Choices of Low-loss materials for 5G smartphone and CPE |
| 10. | COMPANY PROFILES |
| 10.1. | Ampleon |
| 10.2. | Atheraxon |
| 10.3. | Alcan systems |
| 10.4. | Amkor |
| 10.5. | ASE |
| 10.6. | Blueshift Materials |
| 10.7. | Commscope |
| 10.8. | Covestro |
| 10.9. | Chasm Advanced Materials |
| 10.10. | Ericsson (2021) |
| 10.11. | EnPro Industries |
| 10.12. | Freshwave |
| 10.13. | Huawei |
| 10.14. | Henkel |
| 10.15. | HD Microsystems |
| 10.16. | JCET |
| 10.17. | Kyocera |
| 10.18. | Nokia |
| 10.19. | NXP Semiconductors |
| 10.20. | Omniflow |
| 10.21. | Panasonic |
| 10.22. | Picocom |
| 10.23. | Pivotal Commware |
| 10.24. | Renesas Electronics Corporation |
| 10.25. | Resonac |
| 10.26. | Solvay |
| 10.27. | Showa Denko |
| 10.28. | TMYTEK |
| 10.29. | Taiyo Ink |
| 10.30. | TSMC |
| 10.31. | Vitron |
| 10.32. | ZTE |
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2024-2034年5G和6G封装天线（AiP）：技术、趋势和市场
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电子版及 1 份硬拷贝文件（1-5 名用户）
£6,450.00
电子版及 1 份硬拷贝文件（6-10 名用户）
£8,850.00
电子版（1-5 名用户）
€6,400.00
电子版（6-10 名用户）
€9,100.00
电子版及 1 份硬拷贝文件（1-5 名用户）
€7,310.00
电子版及 1 份硬拷贝文件（6-10 名用户）
€10,010.00
电子版（1-5 名用户）
$7,000.00
电子版（6-10 名用户）
$10,000.00
电子版及 1 份硬拷贝文件（1-5 名用户）
$7,975.00
电子版及 1 份硬拷贝文件（6-10 名用户）
$10,975.00
电子版（1-5 名用户）
元50,000.00
电子版（6-10 名用户）
元72,000.00
电子版及 1 份硬拷贝文件（1-5 名用户）
元58,000.00
电子版及 1 份硬拷贝文件（6-10 名用户）
元80,000.00
电子版（1-5 名用户）
¥990,000
电子版（6-10 名用户）
¥1,406,000
电子版及 1 份硬拷贝文件（1-5 名用户）
¥1,140,000
电子版及 1 份硬拷贝文件（6-10 名用户）
¥1,556,000
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