EVパワーエレクトロニクスの熱管理 2024-2034年：予測、技術、市場、トレンド

（詳細は目次のページでご確認ください）

1. 概要

2. EVパワーエレクトロニクスの概要

3. 片面冷却

4. 両面冷却

5. TIM1

5.1 Ag焼結TIM

5.2 Cu焼結TIM

6. TIM2

6.1 TIM2 Si IGBT

6.2 TIM2 SiC MOSFET

6.3 TIMの除去

7. TIM1とTIM2の概要

8. ワイヤーボンディング

9. 基板材料

10. 電力半導体のサプライチェーン

11. 水冷と油冷

12. EVパワーエレクトロニクス冷却使用事例

13. 予測

 

● EVパワーエレクトロニクスのレビュー（Si IGBT、SiC MOSFET、GaNを含む）

● EVパワーエレクトロニクスのさまざまな層のTIM分析（ダイアタッチ、基板アタッチ、TIM2を含む）

● SiC MOSFETサプライヤー（自動車OEM別）と半導体サプライヤー概要

● 片面および両面冷却の詳細な技術分析と商用利用事例分析

● TIM1（ダイアタッチと基板アタッチ）の詳細な技術分析（はんだ、銀焼結TIM、銅焼結TIMを含む）。Cu焼結ペーストサプライヤー概要

● Si IGBTとSiC MOSFETのTIM2技術分析。熱伝導率、厚さ、比重のベンチマーク比較

● ワイヤーボンディング技術と傾向

● EV電力半導体/モジュールサプライヤーの基板材料とマーケットシェアレビュー

● パワーエレクトロニクスサプライチェーン（D25半導体サプライヤー、電力モジュールサプライヤー、インバーターメーカー、自動車OEMを含む）の包括的分析

● 電力モジュールの水冷と油冷レビュー

● ダイアタッチ、基板アタッチおよびTIM2の電力1kWあたりのTIM面積（mm2/kW）比較

● 2024年から2034年までのダイアアタッチ材料領域と市場価値予測

● 2024年から2034年までの基板アタッチ材料領域と市場価値予測

● 2024年から2034年までのTIM2領域と市場価値予測

● 空気、油、水グリコールによるモーターとインバータの冷却

 

IDTechEx has observed a growing trend towards 800V platforms and beyond, driven by several automotive OEMs including GM, Hyundai, VW, and Lucid Motors. These platforms, operating at higher voltages, are enhancing efficiency by minimizing joule losses and enabling the downsizing of high-voltage cabling, thereby reducing weight. This transition is facilitated by the adoption of new technologies and materials, particularly silicon carbide (SiC) MOSFETs, which incorporate innovative thermal management techniques and materials such as double-sided cooling (DSC), advanced Ag sintered die-attach, alongside the use of high-performance thermal interface materials.

 

Moving from traditional silicon IGBTs to SiC MOSFETs also entails changes in thermal architecture design. Examples include the implementation of DSC, copper ribbon bonding, and direct liquid cooling to eliminate the need for thermal interface materials (TIMs).

 

In its report titled "Thermal Management for EV Power Electronics 2024-2034: Forecasts, Technologies, Markets, and Trends", IDTechEx offers a comprehensive market forecast for power electronics thermal management strategies, segmented by SiC MOSFET, Si IGBT, and GaN technologies. The report provides detailed projections for die-attach, substrate-attach, and TIM area, volume, and market value by SiC, Si, and GaN, as well as a breakdown of die-attach methods including traditional solders, Ag sintering, and emerging Cu sintering. Additionally, the report covers the market for liquid-cooled inverters, segmented by air, oil, and water-glycol cooling methods.

 

As power semiconductors experience increased power density and heat flux, coupled with the transition from Si IGBT to SiC MOSFET, the thermal architecture of power semiconductor packaging is anticipated to undergo significant changes. The diagram provided illustrates the key layers of materials in power modules, comprising die-attach materials, substrate-attach materials, wire bonding, and thermal interface materials.

 

The semiconductor dies are affixed to a double-bonded ceramic (DBC) substrate using die-attach materials. Subsequently, the DBC is connected to a baseplate via another substrate-attach material. Communication between the dies and circuitry is facilitated through wire bonding, traditionally using aluminum but with a growing preference for copper. To ensure protection and stability, the package is potted with thermally conductive silicone gels.

 

Die-attach and substrate-attach materials typically consist of solder alloys like SnPb or SAC (Sn-Ag-Cu). These alloys are chosen for their high bulk thermal conductivity, and upon soldering, they form intermetallics between components, resulting in low interfacial thermal resistance. This maintains low package stress and processing temperature while also mechanically fastening the heat sink. The typical thermal conductivity of solder alloys is around 50W/mK, with melting temperatures around 200°C.

 

However, as heat flux increases due to the transition from Si IGBT to SiC MOSFET, junction temperatures are expected to surpass 175°C, or even 200°C in some cases, posing challenges for traditional solders. This shift has led to a transition from solders to sintered die-attach materials. Some leading automotive OEMs, including Tesla, Hyundai, and BYD, have already begun adopting Ag-sintered die-attach materials. Nonetheless, Ag-sintered pastes are significantly more expensive than traditional solder alloys. While costs are influenced by customer relationships, order volume, and various other factors, IDTechEx estimates that Ag-sintered pastes can be 5 times more expensive than traditional solder alloys. In the short to medium term, it is expected that silver sintered paste will primarily be adopted by leading automotive OEMs due to their greater bargaining power with higher volumes to reduce costs. There is also scope for people to replace Cu-sintered die-attach thanks to their theoretically lower costs compared with Ag-sintered die-attach. However, as of 2024, IDTechEx has not seen any large-scale commercial examples of Cu-sintered die-attach materials. This report compares and analyzes the benefits and drawbacks of Ag and Cu-sintered die-attach, along with the market forecast of these two technologies. Despite the benefits of sintering, many semiconductor suppliers and automotive OEMs will remain with solder alloys due to their reduced cost and advances happening with their application.

 

TIM2 typically comes in two forms in EV power semiconductors: thermal grease, employed between the baseplate and the heatsink, and thermal gel, often utilized as potting materials. The market in 2024 sees thermal greases typically exhibiting a thermal conductivity between 2.5 and 3.5W/mK and a density of around 2.5g/ml. However, there have been advancements in TIMs, such as Honeywell's PTM7000 used in onsemi's VE-Trac, demonstrating a thermal conductivity of 6.5W/mK. IDTechEx predicts a trend towards higher thermal conductivity due to the increasing heat flux resulting from the adoption of SiC technology. Further to this, phase change materials (PCM) also gain significant momentum thanks to their superior latent heat capacity. The thermal impedance using PCM can reduce by over 50% compared with traditional thermal grease, although this largely depends on the materials used, configurations, and many other factors. The report benchmarks a number of commercial TIM2 options and conducts a granular analysis of their mechanical properties.

 

The Thermal Management for EV Power Electronics report also summarizes the emerging trends in thermal architecture evolution. Take the two trends below as an example.

1. Double-sided cooling (DSC): Double-sided cooling has been implemented in some mid- to high-end electric vehicles, such as the Porsche Taycan and Audi e-tron. This approach offers superior cooling capacity where the junction temperature can be reduced by 40%. However, the adoption of double-sided cooling results in a more complicated and expensive design. In contrast to single-sided cooling, DSC replaces wire bonding with lead frames and may potentially double the amount of die attach and TIM used.

2. Direct liquid cooling: Another emerging trend is the transition from traditional cooling methods to direct liquid cooling, where the double-bonded copper (DBC) is directly affixed to a pin-fin structured heatsink. This configuration allows for the elimination of the cold plate and thermal grease.

 

The report forecasts that the combined market size of die-attach materials, substrate-attach materials, and TIM2 for EV power electronics will reach approximately US$900 million by 2034, presenting significant market opportunities. As thermal power continues to rise, it is expected that more advanced thermal management strategies will be adopted, thereby accelerating market growth at a double-digit Compound Annual Growth Rate (CAGR) from 2024 to 2034.

 

For a deeper understanding of the market opportunities, active players, competitive landscape, technology benchmarking, and recent market developments, readers are encouraged to refer to IDTechEx's latest report, "Thermal Management for EV Power Electronics 2024-2034: Forecasts, Technologies, Markets, and Trends".

 

This report provides critical market intelligence about the area, volume, weight, and market value of die-attached solders, substrates, and TIM2s for electric vehicle power electronics, in particular, Si IGBT, SiC MOSFET, and GaN.

 

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